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学生对 Arizona State University 提供的 Semiconductor Packaging Manufacturing 的评价和反馈

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66 个评分

课程概述

This course will provide information on the various stages of semiconductor package manufacturing, including sort, assembly, and final test. In addition, we will also describe how to select, build, and test the packages with the die and other components to ensure the quality of the package and total assembly performance. We will also discuss the role of Process Control Systems in semiconductor manufacturing as they relate to quality testing. Specifically, we will explore how Process Control Systems can help identify and correct process problems that cause variation and quality issues. Finally, we also demonstrate how to use control charts to monitor the process performance. These can assist in decision-making, specifically when to take action to improve the process....

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1 - Semiconductor Packaging Manufacturing 的 11 个评论（共 11 个）

创建者 Dileepa R

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Dec 8, 2024

I appreciate This course and the insights you shared throughout the knowledge. This has been a rewarding learning experience, and I’m grateful for your guidance and support.

创建者 Đặng Q V

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Oct 5, 2023

The course provides me with a lot of knowledge and experience. It could be helpful for me in my job.

创建者 Oscar M 毛

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Dec 5, 2023

Very informative, thanks for the content!

创建者 ASRI,Reena

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Jun 28, 2024

very well explained

创建者 Satyam B

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Jul 19, 2024

Outstanding !!

创建者 Soumya M

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Feb 4, 2025

Informative

创建者 Sachin P

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Sep 21, 2024

very good

创建者 민건희

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May 15, 2024

Good.

创建者 Perez C J

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Nov 4, 2024

nice

创建者 Sandy H

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Jul 1, 2025

not very clear explanation and definition in many common used industry terminologies.

创建者 lucas n

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Sep 19, 2024

As a pioneer in the industry, Intel should share more detailed materials or case studies, especially considering the advancements and maturity of packaging, assembly, and testing since Moore's era.