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学生对 Arizona State University 提供的 Introduction to Semiconductor Packaging 的评价和反馈

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149 个评分

课程概述

This course will cover various aspects of microelectronics and nanoelectronics. This field aims to advance and improve the functionality of electronic devices by scaling transistors to smaller feature sizes. The course will introduce you to essential concepts such as length scales, transistor actions, and feature sizes of integrated circuits. The course will also look at historical observations and trends using Moore’s Law, which currently guides and predict development of the Semiconductor industry. Most importantly, our goal is to highlight why packaging is so important and relevant today. Furthermore, we will also explore the anatomy and function of a semiconductor package, starting with substrate-level package interconnection to the motherboard. We will also describe features as we differentiate various types of packages and how they differ in materials, design, and reliability....

热门审阅

SK

Feb 20, 2024

Awesome course by Terry Alford sir,And thanks for approving my financial aid request, Completed the course today. Thank You!! 😊

AA

Jun 24, 2024

very informative with simple understandable language. course content prepared is with fragmented detail... easy to understand and grasp.

筛选依据：

26 - Introduction to Semiconductor Packaging 的 33 个评论（共 33 个）

创建者 Srushti S M

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Sep 21, 2024

good

创建者 Sahera b

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Oct 18, 2024

-

创建者 Oscar M 毛

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Nov 30, 2023

The course is excellent, but many times the exam questions were taken from content that you get to see in the next lesson, which doesn't make much sense. But it was very informative and superbly taught, thanks a lot!

创建者 Li J

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Sep 13, 2024

The course is well-organized and informative. However, the quiz questions are not matched to the modules, and many appear before the lectures.

创建者 Kapil R

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Jul 4, 2024

Excellent course, and I can't thank enough. The quiz are frustrating, they are not aligned with the material taught.

创建者 Pavithran

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Mar 14, 2024

good

创建者 Chintan B

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Jun 11, 2025

Exam questions are vague and some answers are wrong

创建者 lucas n

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Sep 19, 2024

As a pioneer in the industry, Intel should share more detailed materials or case studies, especially considering the advancements and maturity of packaging, assembly, and testing since Moore's era. This course imho more suitable at high school level.