学生对 Arizona State University 提供的 Advanced Semiconductor Packaging 的评价和反馈
课程概述
热门审阅
1 - Advanced Semiconductor Packaging 的 14 个评论（共 14 个）
创建者 lucas n
•Sep 19, 2024
As a pioneer in the industry, Intel should share more detailed materials or case studies, especially considering the advancements and maturity of packaging, assembly, and testing since Moore's era.
创建者 Basil E
•Feb 6, 2024
This course provides a great overview and Roadmap for Heterogeneous Integration and Advanced packaging. A great starting point for anyone who wants to explore the world of HI.
创建者 Adokanou
•Jul 12, 2025
Complete course for IC Packaging topics
创建者 2023 1
•Mar 10, 2024
Good and Informative Course!
创建者 Dinesh R
•Mar 22, 2025
Excellent Course!
创建者 Sachin P
•Sep 21, 2024
very good
创建者 Perez C J
•Nov 1, 2024
excelent
创建者 민건희
•May 15, 2024
Good.
创建者 Swetha r G
•Sep 11, 2024
good
创建者 Sonal
•Nov 21, 2024
-
创建者 Ranganath K
•Mar 29, 2024
Very well deliverd and extremely pleased with the contents
创建者 01fe20bec164
•Oct 18, 2024
-
创建者 Boyi F
•Nov 15, 2023
I hope this class can provide more detailed introduction of advanced packaging techniques, such CoWoS, EMIB, CPO....
创建者 Gonçalo S
•Dec 6, 2024
Should be more detailed oriented. Target public seems to be marketing